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  this is information on a product in full production. september 2013 docid024094 rev 2 1/15 1 tda7387 4 x 41 w quad bridge car radio amplifier datasheet - production data features ? high output power capability: ? 4 x 41 w / 4 ? max. ? low distortion ? low output noise ? standby function ? mute function ? automute at min. supply voltage detection ? low external component count: ? internally fixed gain (26 db) ? no external compensation ? no bootstrap capacitors ? protections: ? output short circuit to gnd, to v s , across the load ? very inductive loads ? overrating chip temperature with soft thermal limiter ? load dump voltage ? fortuitous open gnd ? reversed battery ? esd description the tda7387 is an ab class audio power amplifier, packaged in flexiwatt 25 and designed for high end car radio applications. based on a fully complementary pnp/npn configuration, the tda73 87 allows a rail to rail output voltage swing with no need of bootstrap capacitors. the extremely reduced boundary components count allows very compact sets. '!0'03 flexiwatt25 flexiwatt25 (vertical exposed pad) '!0'03 table 1. device summary order code package packing tda7387 flexiwatt25 tube tda7387ep flexiwatt25 vertical, exposed pad tube TDA7387EPAG flexiwatt25 vertical, exposed pad tube www.st.com
contents tda7387 2/15 docid024094 rev 2 contents 1 block and pin connection diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.4 pcb and component layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.5 electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3 application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.1 biasing and svr . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.2 input stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.3 standby and muting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 3.4 stability and layout considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 4 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
docid024094 rev 2 3/15 tda7387 list of tables list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 3. thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 4. electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 5. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
list of figures tda7387 4/15 docid024094 rev 2 list of figures figure 1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2. pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 3. standard test and application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 4. components and top copper layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 5. bottom copper layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 6. quiescent curren t vs. supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 7. quiescent output voltage vs. supp ly voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 8. output power vs. supply voltage (4 ? ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 9. distortion vs. output power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 10. distortion vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 11. power dissipation and efficiency vs. output power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 12. input/output biasing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 13. flexiwatt25 mechanical data and package dimensio ns . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 14. flexiwatt25 mechanical data and package dimensio ns . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
docid024094 rev 2 5/15 tda7387 block and pin connection diagrams 1 block and pin connection diagrams figure 1. block diagram figure 2. pin connection (top view) '!0'03 ).  m & -54% 34 "9 ).  m & /54 /54 /54 /54 07 '.$ ).  m & ).  m & /54 /54 /54 /54 07 '.$ 07 '.$ 07 '.$ !# '.$  m & m & 362 4!" 3 '.$ 6cc 6cc n&  m & .# '!0'03 -54% 4! " 0 '.$ /54 34 "9 /54 6 ## /54 0 '.$ /54 362 ). ). 3 '.$ ). ). !# '.$ /54 0 '.$ /54 6 ## /54 /54 0 '.$ .#  
electrical specifications tda7387 6/15 docid024094 rev 2 2 electrical specifications 2.1 absolute maximum ratings 2.2 thermal data 2.3 electrical characteristics v s = 14.4 v; f = 1 khz; r g = 600 ? ; r l = 4 ? ; t amb = 25 c; refer to t he test and application diagram ( figure 3 ), unless other wise specified. table 2. absolute maximum ratings symbol parameter value unit v s operating supply voltage 18 v v s (dc) dc supply voltage 28 v v s (pk) peak supply voltage (t = 50 ms) 50 v i o output peak current: repetitive (duty cycle 10 % at f = 10 hz) non repetitive (t = 100 s) 4.5 5.5 a a p tot power dissipation, (t case = 70 c) 80 w t j junction temperature 150 ? c t stg storage temperature ? 55 to 150 ? c table 3. thermal data symbol parameter value unit r th j-case thermal resistance junction-to-case max. tda7387 tda7387ep/epag 1 1.3 c/w t amb operative temperature r ange tda7387ep -30 to +85 ? c operative temperatur e range tda7387,TDA7387EPAG -40 to +105 ? c table 4. electrical characteristics symbol parameter test condition min. typ. max. unit i q1 quiescent current - - 180 300 ma v os output offset voltage - - - 100 mv g v voltage gain - 25 26 27 db p o output power thd = 10% thd = 1% 20 - 22 18 -w
docid024094 rev 2 7/15 tda7387 electrical specifications figure 3. standard test and application circuit p o max. max. output power (1) v s = 14.4 v 33 37 - w v s = 15.2 v - 41 - thd distortion p o = 4 w - 0.04 0.3 % e no output noise "a" weighted; bw = 20 hz to 20 khz - 50 65 150 ? v ? v svr supply voltage rejection f = 100 hz 50 65 - db f cl low cut-off frequency - - 20 - hz f ch high cut-off frequency - 75 - khz r i input impedance - 70 100 - k ? c t cross talk f = 1 khz 50 70 - db i sb standby current consumption v standby = 0 v - - 15 a v sb out standby out threshold voltage (amp: on) 3.5 - - v v sb in standby in threshold voltage (amp: off) - - 1.5 v a m mute attenuation v o = 1vrms 80 90 - db v m out mute out threshold voltage (amp: play) 3.5 - - v v m in mute in threshold voltage (amp: mute) - - 1.5 v i m (l) muting pin current v mute = 1.5 v (source current) 5 10 16 a 1. saturated square wave output. table 4. electrical ch aracteristics (continued) symbol parameter test condition min. typ. max. unit '!0'03 ).  m & #  m & ). # m & /54 /54 ). # m & ). # m & /54 /54 #  m & #  m & 362 4!" 6cc  6cc  #  m & #  m & #  m & 34 "9 2 + 2 + -54% #        3 '.$     .#             
electrical specifications tda7387 8/15 docid024094 rev 2 2.4 pcb and component layout refer to figure 3: standard test and application circuit . figure 4. components and top copper layer figure 5. bottom copper layer
docid024094 rev 2 9/15 tda7387 electrical specifications 2.5 electrical char acteristics curves figure 6. quiescent current vs. supply voltage figure 7. quiescent output voltage vs. supply voltage figure 8. output power vs. supply voltage (4 ? ) figure 9. distortion vs. output power figure 10. distortion vs. frequency figure 11 . power dissipation and efficiency vs. output power '!0'03 '!0'03 '!0'03                   0o7 4($ 4($ 2 , /hm f+(z 6s6 '!0'03 '!0'03 '!0'03 0 tot 7 0 tot h h
application hints tda7387 10/15 docid024094 rev 2 3 application hints refer to figure 3 . 3.1 biasing and svr as shown in figure 12 , all the tda7387?s main sections, such as inputs, outputs and ac- gnd (pin 16) are internally biased at half supply voltage level (vs/2), coming from the supply voltage rejection (svr) block. in this way no current flows through the internal feedback network. the ac-gnd is common to all the 4 amplifiers and represents the connection point of all the inverting inputs. both individual inputs and ac-gnd are co nnected to vs/2 (svr) by means of 100 k ? resistors. to ensure proper operation and high supply voltage rejection, it is of fundamental importance to provide a good impedance matching bet ween inputs and ac-ground terminations. this implies that c 1 , c 2 , c 3 , c 4 , c 5 capacitors have to carry the same nominal value and their tolerance should never exceed 10 %. besides its contribution to the ripple rejection, the svr capacitor controls the turn on/off time sequence and, consequently, plays an essential role in the pop optimization during on/off transients. to conv eniently serve both needs, its minimum recommended value is 10f . figure 12. input/output biasing. 3.2 input stage the tda7387?s inputs are ground-compatible and can stand very high input signals ( 8 vpk) without any performances degradation. if the standard value for the input capacitors (0.1 f) is adopted, the low frequency cut-off turns out to be 16 hz.  m & # ?# + 7 + 7  7  7 + 7 + 7 + 7 ). '!0'03 4/7!2$3 /4(%2#(!..%,3 + 7 + 7 6 3  m & #  m & # 362 !#?'.$
docid024094 rev 2 11/15 tda7387 application hints 3.3 standby and muting standby and muting facilit ies are both cmos-compatible. if unused, a straight connection to vs of their respective pins would be admissible. conventional low-power transistors can be used to drive muting and stand-by pins in abs ence of true cmos ports or microprocessors. r-c cells have always to be used in order to smooth down the transitions for preventing any audible transient noises. since a dc current of about 10 a normally flows out of pin 22, the maximum allowable muting-series resistance (r 2 ) is 70 k ? , which is sufficiently high to allow a muting capacitor reasonably small (about 1 f). if r 2 is higher than recommended, the involved risk is that the voltage at pin 22 may rise to above the 1.5 v threshold voltage and the device is consequently fails to turn off when the mute line is brought down. about the stand-by, the time constant to be a ssigned in order to obtain a virtually pop-free transition has to be slower than 2.5 v/ms. 3.4 stability and la yout considerations if properly layouted and hooked to standard ca r-radio speakers, the tda7387 is intrinsically stable with no need of external compensations such as output r-c cells. due to the high number of channels involved, this translates into a very remarkable components saving if compared to similar devices on the market. to simplify pc-board layout design, each amplifier stage has its own power ground externally accessible (pins 2,8,18,24) and one supply voltage pin for each couple of them. even more important, this makes it possible to achiev e the highest possible degree of separation among the channels, with remarkable benefits in terms of cross-talk and distortion features. about the layout grounding, it is particular ly important to connect the ac-gnd capacitor (c 5 ) to the signal gnd, as close as possible to the audio inputs ground: this guarantees high rejection of any common mode spurious signal. the svr capacitor (c 6 ) has also to be connected to the signal gnd. supply filtering elements (c 7 , c 8 ) have naturally to be connected to the power-ground and located as close as possible to the vs pins. pin 1, which is mechanically attached to the device?s tab, needs to be tied to the cleanest power ground point in the pc-board, which is gen erally near the supply filtering capacitors. the exposed pad package doesn't require any pa rticular care compared to the st standard flexiwatt package. for particular pcb configurations, in order to maximize the rejection against any disturbances coming from the battery line (svr), it is suggested to use one of the following ic metal slug (heat-sink) connections: ? leave the slug simply electrically isolated from the pcb ground; ? in case of 2 layers board, connect the sl ug to the pcb power ground (p-gnd) and not to the signal ground (s-gnd); ? in case of a pcb with a layer dedicated to grounding (wide / diffused gnd area with no distinction between p-gnd and s-gnd) connect the slug to the common board ground.
package information tda7387 12/15 docid024094 rev 2 4 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 13. flexiwatt25 mechanical data and package dimensions '!0'03 /54,).%!.$ -%#(!.)#!,$!4! $)- mm inch -). 490 -!8 -). 490 -!8 !       "       #   $       %       &   '       '        (       (   (   (    ,       ,        ,       ,       ,   ,    -       -       .   /   2   2    2   2    2    6 ? 7\s 6 ? 7\s 6 ? 7\s 6 ? 7\s  moldingprotusionincluded  dam barprotusionnotincluded &lexiwattvertical ( 2 ' 6 ' , ( ( & - , &,%8-% 6 / , , ( 2 . 6 2 2 2 # " , - 2 , 2 2 % $ ! 0in 6 6 6 
docid024094 rev 2 13/15 tda7387 package information figure 14. flexiwatt25 mechanical data and package dimensions )oh[lzdww9huwlfdo ([srvhgsdg 287/,1($1' 0(&+$1,&$/'$7$ $ *$3*36 ',0 pp lqfk 0,1 7<3 0$; 0,1 7<3 0$; $             % &   '       (       (       (       (   (   (   )   *       *             + +   +   +   /       /       /       /       /   /   0       0        1 2  5     5   5   5   5   9 ? 7\s 9 ? 7\s 9 ? 7\s 9 ? 7\s 'lphqvlrq3)gdpedusurwxvlrqqrwlqfoxghg 'lphqvlrqv+//proglqjsurwxvlrqlqfoxghg 9 % 2 / / / / / / / ' 9 & 9 9 9 5 5 5 9 5 1 5 + $ ( ( ( ( ( ( ( 0 ( 0 5 5 5 + + + * * )
revision history tda7387 14/15 docid024094 rev 2 5 revision history table 5. document revision history date revision changes 09-apr-2013 1 initial release. 18-sep-2013 2 updated disclaimer.
docid024094 rev 2 15/15 tda7387 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particul ar purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ? automotive, automotive safe ty or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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